Effect of surface conditioning methods, adhesive systems and resin composite on repair strength of dimethacrylate and silorane resin composites

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Lima A. F., de Vicente Leite T., Palialol A. M., Catelan A., Baggio Aguiar F. H., Marchi G. M., ...More

Journal of Adhesion Science and Technology, vol.30, no.24, pp.2736-2744, 2016 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 30 Issue: 24
  • Publication Date: 2016
  • Doi Number: 10.1080/01694243.2016.1199217
  • Journal Name: Journal of Adhesion Science and Technology
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.2736-2744
  • Keywords: Adhesion, adhesive system, bond strength, resin composite, repair, silorane, surface conditioning
  • Istanbul Medipol University Affiliated: Yes


This study evaluated the effect of surface conditioning methods and adhesive systems on the repair bond strength of resin composites. Specimens (FLS: Filtek LS) (N = 144) were prepared using a silicone matrix. The specimens were stored in distilled water and then were randomly divided into the twelve groups (n = 12) according to the surface conditioning method (unground or diamond bur) and adhesive system (no adhesive, LS: Filtek LS, AS: Adper Scotchbond SE Plus) and resin composite (FLS: Filtek LS; FS: Filtek Supreme). The specimens were fixed in an hourglass-shaped silicone matrix and the other half of the specimen was restored. Hourglass-shaped specimens (n = 12) were used as positive control to measure the cohesive strength of the resin composite (Filtek LS). Microtensile bond test was performed (0.5 mm/min) and failure types were analyzed. Data were analyzed using two-way analysis of variance, Tukey’s and Dunnett’s tests (α = 0.05). Adhesive protocol and resin composite significantly affected the results (p < 0.05). For the FS composite, the highest results were obtained using LS adhesive with (18.4 ± 7.7) and without (18.8 ± 4.8) bur roughening. For FLS composite, the highest results were obtained using AS adhesive with (33.2 ± 7.1) and without (25.7 ± 3.6) bur roughening. Without the use of adhesive resin, significantly lower bond strength results were observed with both LS (5 ± 2.1, 4.5 ± 1.5) and FLS (2.2 ± 1.2, 4.4 ± 1.1) for unground and diamond bur roughened groups, respectively (p < 0.0001). Cohesive strength of the FLS (52.3 ± 7.6) was significantly higher than any of the repaired groups (p < 0.0001). FS–LS combination and the groups repaired without adhesive presented more adhesive (Type I) failures.